Upcoming Publication

We recently received notification that our paper titled "Ethernet Device Authentication via Physical Layer Fingerprinting" was accepted for publication at IEEE SoutheastCon 2023.  This paper encompasses a small portion of the work that we completed as part of our Department of Energy Phase I SBIR project titled "Physical layer Authentication of Wired Networks (PAWN)" which was completed in June of 2020.  We have included a pre-print of the work at the link below and will be presenting at the virtual IEEE SoutheastCon event in early April.

Over the last two years, we have continued our research into physical layer device authentication beyond what is presented in this paper and hope to publish additional findings in the near future.  More recently, we have been focused on the development of our IdentiPHY:Wired prototype system and the corresponding software platform.  There is additional content available on the News site.